Jobs found
TEG Assembly Equipment Engineer (Intern)
Malaysia
Intel
TEG Assembly Equipment Engineer (Intern)
Malaysia
Intel Corporation
Senior Assembly Equipment Engineer - Wirebond
Perai, Seberang
Micron
RF Assembly Process Engineering Manager
Kuala Lumpur
NXP Semiconductors
Assembly Equipment Engineer – Encapsulation/Post Encapsulation
Malaysia
Micron Memory Malaysia Sdn Bhd
General Manager (Plastic Injection Molding & Assembly)
Batu Pahat, Chaah, Johor Bahru
Searchlab International
Senior/Staff Assembly Equipment Engineer (Wire Bond/Die Attach)
Johor Bahru
Micron
Manufacturing Executive
Batu Caves
Linatex Rubber Products Sdn. Bhd